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APL1085
3A Low Dropout Fast Response Positive Adjustable Regulator and Fixed 3.3V
Features
* * * * * * * *
Fast Transient Response Guaranteed Dropout Voltage at Multiple Currents Load Regulation : 0.05% Typ. Line Regulation : 0.03% Typ. Low Dropout Voltage : 1.2V Typ. at IOUT =3A Trimmed Current Limit : 3A Typ. at TJ=125 C On-Chip Thermal Limiting : 150 C Typ. Standard 3-pin TO-220 , TO-252 and TO-263 Power Package
General Description
The APL1085 is a low dropout three-terminal adjustable regulator with 3A output current capability. In order to obtain lower dropout voltage and faster transient response, which is critical for low voltage applications, the APL1085 has been optimized. The output available voltage range of adjustable version is from 1.25~5.75V with an input supply below 7V , and the fixed 3.3V output voltage device is also available. Current limit is trimmed to ensure specified output current and controlled short-circuit current. On-chip thermal limiting provides protection against any combination of overload that would create excessive junction temperatures. The APL1085 is available in both the through-hole and surface mount versions of the industry standard
Applications
* * * * *
PentiumTM Processor Supplies PowerPC
TM
Pin Description
3
TAB is VOUT
Supplies
VIN VOUT ADJ 2 1
Low Voltage Logic Supplies Battery-Powered Circuitry Post Regulator for Switching Power Supply
Front View APL1085 TO-220 Package
3
V IN V OUT AD J
TA B is V OU T
2 1
Front View APL1085 TO-252 Package
3
TA B is V OU T
V IN V OUT AD J
2 1
Front View APL1085 TO-263 Package
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. B.5 - Jun., 2003 1 www.anpec.com.tw
APL1085
Ordering Information
APL1085 L e a d F re e C o d e H a n d li n g C o d e Tem p. R ange Package C ode V o lt a g e C o d e Package C ode F : T O -2 2 0 U : T O -2 5 2 Tem p. R ange C : 0 t o 7 0 C H a n d li n g C o d e TU : Tube V o lt a g e C o d e : 3 3 : 3 .3 V L e a d F re e C o d e L : L e a d F r e e D e v ic e 33 AP L1085 XXXXX G : T O -2 6 3
TR : Tape & Reel B la n k : A d ju s t a b l e V e r s io n B l a n k : O r ig i n a l D e v ic e
AP L1085:
AP L1085 XXXXX
XXXXX
- D a te C o d e
A P L 1 0 8 5 -3 3 :
XXXXX
- D a te C o d e
Absolute Maximum Ratings
Symbol VI TJ Parameter Input Voltage Operating Junction Temperature Range Control Section Power Transistor Storage Temperature Range Lead Temperature (Soldering, 10 second) Rating 7 0 to 125 0 to 150 -65 to +150 260 Unit V C
TSTG TL
C C
Electrical Characteristics
Symbol VREF VOUT REGLINE Parameter Test Conditions APL1085 Unit Min. Typ. Max. 1.225(-2%) 1.250 1.275(+2%) V V %
REGLOAD
VD ILIMIT
IADJ
Reference Voltage 1.5V(VIN -VOUT) 5.75V, 10mA IOUT 3A, TJ =0~125C Output Voltage 10mA IOUT 3A, 4.75VVIN 7V, 3.235(-2%) 3.300 3.365(+2%) APL1085-3.3 TJ =0~125C 0.03 0.2 Line Regulation TJ =0~125C, (Notes 1) APL1085 2.75VVIN 7V, IOUT=10mA, APL1085-3.3 4.75VVIN 7V, IOUT=0mA , Load Regulation TJ=25C, (Notes 1) APL1085 (VIN -VOUT)=3V, 10mA IOUT 3A 0.05 0.3 APL1085-3.3 VI N=5V, 0mA IOUT 3A 0.05 0.5 Dropout Voltage 1.3 1.4 VREF=1% ,IOUT=3A ,TJ =0~125C Current Limit 4.5 6.0 (VIN -VOUT)=1.7V, TJ=25C 3.5 5.0 TJ=125C 5.0 6.5 TJ=25C (VIN -VOUT)=3V, 4.0 5.5 TJ=125C 60 120 Adjust Pin Current (VIN -VOUT)=3V, IOUT=10mA, TJ=0125C
2
%
V
A A
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003
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APL1085
Electrical Characteristics Cont.
Symbol IADJ Parameter Test Conditions Min. Adjust Pin Current 1.5V( VIN -VOUT)5.75V, Change APL1085 10mA IOUT 3A ILMIN Minimum Load 1.5V( VIN -VOUT)5.75V, Current APL1085 TJ=0125C IQ Quiescent Current VI N=5V APL1085-3.3 PSRR Ripple Rejection F=120Hz, Cout=22F, Tant. , (VIN -VOUT)=3V, IOUT=3A LS Long -Term TJ =125C,1000Hrs. Stability VN RMS Output TJ=25C,10Hz? F? 10kHz Noise(% of VOUT) Control Circuitry/Power Thermal JC Transistor Resistance Junction to Case APL1085 Typ. 0.2 2 8 60 0.03 0.003 0.7/3.0 1.0 Unit Max. 5 10 13 A mA mA dB % % C/ W
NOTE 1: See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulations are measured at a constant junction temperature by low duty cycle pulse testing.
Application Circuits
Typical Regulator
VIN (2.75V~7V)
APL1085 10 F + C1 +
VOUT (1.250V/ 3A) Solid Tantalum C2*
5V to 3.3V Regulator
VIN (5V) 10 F C1 APL1085 + R1 + VOUT (3.3V/ 3A) Solid Tantalum C2*
R2
*Required for stability APL1085:C2=10F * R1 is typically in range of 100 to 120
R1/(R1+R2)=1.250V/3.3V
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003
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APL1085
Typical Characteristics
Dropout Voltage vs Output Current
1.5 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0 0.5 1 1.5 2 2.5 3
Short-Circuit Current vs Temperature
14
Shout- Circuit Current (A)
1.4
13 12 11 10 9 8 7 6 5 4 -50
VIN-VOUT (SHORT CIRCUIT) =5V
Dropout Voltage (V)
TJ= -50C
TJ= 25C TJ=0C TJ=125C
VIN-VOUT(SHORT CIRCUIT) =3.3V
0
50
100
150
Output Current (A)
Temperature (C)
Load Regulation vs Temperature
0.10 I =3A
Reference Voltage vs Temperature
1.275 1.270 1.265
Output Voltage Deviation (%)
0.05
Reference Voltage (V)
0.0 -0.05 -0.10 -0.15 -0.20 -50 0 50 100 150
1.260 1.255 1.250 1.245 1.240 1.235 1.230 1.225 -50 0 50 100 150
Temperature (C)
Temperature (C)
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003
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APL1085
Typical Characteristics (Cont.)
Minimum Load Current vs Temperature
5 100 90
Adjust Pin Current vs Temperature
Minimum Load Current (mA)
Adjust Pin Current (A)
4 3 2 1 0 -50
80 70 60 50 40 30 20 10 0 -50
0
50
100
150
0
50
100
150
Temperature (C)
Temperature (C)
Ripple Rejection vs Frequency
90 80 70 60 20 18 16 14 12
Maximum Power Dissipation*
Ripple Rejection (dB)
40 30 20 10 0 VIN-VOUT = 3V VRIPPLE(p-p) = 1V IOUT = 3A 100 1k 10k 100k
Power (W)
50
10 8 6 4 2 0 50 70 90 110 130 150
10
Frequency (Hz)
Case Temperature (C)
* as Limited by Maximum Jcnction Temperature
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003
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APL1085
Package Information
TO-220 ( Reference JEDEC Registration TO-220)
D Q
R
b E
e b1 e1
L1
H1 A F
L
c
J1
Dim A b1 b c D e e1 E F H1 J1 L L1 R Q
Millimeters Min. 3.56 1.14 0.51 0.31 14.23 2.29 4.83 9.65 0.51 5.84 2.03 12.7 3.65 3.53 2.54 Max. 4.83 1.78 1.14 1.14 16.51 2.79 5.33 10.67 1.40 6.86 2.92 14.73 6.35 4.09 3.43 Min. 0.140 0.045 0.020 0.012 0.560 0.090 0.190 0.380 0.020 0.230 0.080 0.500 0.143 0.139 0.100
Inches Max. 0.190 0.070 0.045 0.045 0.650 0.110 0.210 0.420 0.055 0.270 0.115 0.580 0.250 0.161 0.135
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003
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APL1085
Package Information
TO-252( Reference JEDEC Registration TO-252)
E b2 L2 A C1
D H L1 L b e1 D1 C A1
E1
Dim A A1 b b2 C C1 D D1 E E1 e1 H L L1 L2
M illim et er s M in. 2. 1 8 0. 8 9 0. 5 08 5. 2 07 0. 4 6 0. 4 6 5. 3 34 5. 2 R EF 6. 3 5 5. 3 R EF 3. 9 6 9. 3 98 0. 5 1 0. 6 4 0. 8 9 1. 0 2 2. 0 32
7
Inc he s M ax. 2. 3 9 1. 2 7 0. 8 9 5. 4 61 0. 5 8 0. 5 8 6. 2 2 6. 7 3 5. 1 8 10 . 41 M in. 0. 0 86 0. 0 35 0. 0 20 0. 2 05 0. 0 18 0. 0 18 0. 2 10 0. 2 05 R EF 0. 2 50 0. 2 09 R EF 0. 1 56 0. 3 70 0. 0 20 0. 0 25 0. 0 35 0. 0 40 0. 0 80
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M ax. 0. 0 94 0. 0 50 0. 0 35 0. 2 15 0. 0 23 0. 0 23 0. 2 45 0. 2 65 0. 2 04 0. 4 10
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003
APL1085
Package Information
TO-263
E L2
A c2
D L L3 L1
e
b2 b
c
M illimeters Dim A b b2 c c2 D E e L L1 L2 L3 M in. 4.06 0.51 1.14 1.14 8.64 9.66 14.60 2.24 1.20 M ax. 4.83 0.992 1.399 1.40 9.65 10.299 15.88 2.84 2.92 1.78 M in. 0.160 0.02 0.045 0.045 0.340 0.380 0.575 0.090 0.050
Inches M ax. 0.190 0.039 0.055 0.055 0.380 0.405 0.625 0.110 0.115 0.070
0.38 TYP.
0.015 TYP.
2.543 BSC.
0.100 BSC.
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003
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APL1085
Physical Specifications
Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
TP
(IR/Convection or VPR Reflow)
tp Ram p-up Critical Zone T L to T P
Temperature
TL Tsm ax
tL
Tsm in Ram p-down ts Preheat
25
t 25 C to Peak
Tim e
Classificatin Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds
6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface.
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003 9 www.anpec.com.tw
APL1085
Classificatin Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process - Package Peak Reflow Tem peratures 3 3 Package Thickness Volum e m m Volum e m m <350 350 <2.5 m m 240 +0/-5C 225 +0/-5C 2.5 m m 225 +0/-5C 225 +0/-5C Table 2. Pb-free Process - Package Classification Reflow Tem peratures 3 3 3 Package Thickness Volum e mm Volum e mm Volum e mm <350 350-2000 >2000 <1.6 m m 260 +0C* 260 +0C* 260 +0C* 1.6 m m - 2.5 m m 260 +0C* 250 +0C* 245 +0C* 2.5 m m 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and including the stated classification tem perature (this m eans Peak reflow tem perature +0C. For exam ple 260C+0C) at the rated MSL level.
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245C, 5 SEC 1000 Hrs Bias @125C 168 Hrs, 100%RH, 121C -65C~150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1 tr > 100mA
Carrier Tape & Reel Dimension
t E Po P P1 D
W
F
Bo
Ao
D1
Ko
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003
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APL1085
Carrier Tape & Reel Dimension(Cont.)
T2
J C A B
T1
Application A 330 3 TO-252 F 7.5 0.1 Application A 3803 TO-263 F 11.5 0.1 B 100 2 D 1.5 +0.1 B 80 2 D 1.5 +0.1 C 13 0. 5 D1 1.5 0.25 C 13 0. 5 D1 1.5 0.25 J 2 0.5 Po 4.0 0.1 J 2 0.5 Po 4.0 0.1 T1 T2 16.4 + 0.3 2.5 0.5 -0.2 P1 2.0 0.1 T1 24 4 P1 Ao W 16+ 0.3 - 0.1 Bo P 8 0.1 Ko E 1.75 0.1 t 0.30.05 E 1.75 0.1 t
6.8 0.1 10.4 0.1 2.5 0.1 T2 2 0.3 Ao W 24 + 0.3 - 0.1 Bo P 16 0.1 Ko
2.0 0.1 10.8 0.1 16.1 0.1 5.2 0.1 0.350.013
(mm)
Cover Tape Dimensions
Application TO- 252 TO- 263 Carrier Width 16 24 Cover Tape Width 13.3 21.3 Devices Per Reel 2500 1000
Customer Service
Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369
Copyright ANPEC Electronics Corp. Rev. B.5 - Jun, 2003 11 www.anpec.com.tw

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